Baugruppentechnologie der Elektronik: Montage. Front Cover. Hans-Joachim Hanke, Wolfgang Scheel. Verlag Technik, – pages. Baugruppentechnologie der Elektronik: Leiterplatten. Front Cover. Hans-Joachim Hanke, Wolfgang Scheel. Verlag Technik, – Printed circuits – pages. 1 ] Hanke. H. J. (Editor): ‘ Baugruppentechnologie der Elektronik-Hybridtrager’. – Berlin: Verlag Technik, [] Scheel, W. (Editor): ‘Baugruppentechnologie.

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Product details Hardcover Publisher: Oxidation of Buld Au-Al Intermetallics.

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Three different wire types were bonded on two different Al pad metallization with optimized bonding parameter, stressed by high temperature storage NTS conditions at degC up to hours and investigated by baubruppentechnologie microscopy LMscanning electron microscopy SEM baurguppentechnologie addition to energy dispersive X-ray analysis EDX.


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The paper is focused on the Au-Al intermetallic compound IMC formation and growth as well as the void formation in thermosonic wire bond ball contacts. Discover Prime Book Box for Kids. Materials for Advanced Packaging.

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